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>Electrical Through-Hole and Planar Interconnect Generation in RolI-to-Roll LED Lighting Manufacturing using Industrial Inkjet Printheads
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Electrical Through-Hole and Planar Interconnect Generation in RolI-to-Roll LED Lighting Manufacturing using Industrial Inkjet Printheads
Despite the availability of many high-volume and low-cost manufacturing processes for LED-based lighting applications, relying mainly on fixed patterns such as LED-backlights and RGB-pixelated displays, novel applications, such as "mood lighting" or interior wall displays call for more complicated and shaped LED arrangements. The presented work is based of a novel roll-to-roll (R2R) process to adaptively and cost-efficiently generate LED arrangements on RMPD~® substrates. InkJet printing of planar and though-hole electrical interconnections is of high importance to the process, as it provides a fully digital way of interconnecting devices electrically, accounting for the actual position of the component and spatially provide different ink film thicknesses. Xaar's industrial inkjet printheads are used to dispense defined volumes of 50 pL of a silver nanoparticle ink in order to provide high reliability and good positioning accuracy while maintaining low satellite drop densities. Specific printing strategies are investigated at a print speed of 0.1 m/s to allow for a reliable electrical connection in case of up to 50 urn deep via connections to the buried component. Due to the low glass-transition nature of the underlying substrates, low sintering temperatures are required to preserve the mechanical properties of the substrate. Low temperature oven sintering yielding sufficient conductivity to drive a current of 40 mA will be discussed.
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机译：尽管可以为基于LED的照明应用提供许多大批量，低成本的制造工艺，但主要依靠固定模式（例如LED背光和RGB像素显示器），新颖的应用（例如“心情照明”或内墙显示器）要求更复杂，更整形的LED布置。提出的工作基于一种新颖的卷对卷（R2R）工艺，可在RMPD®®基板上自适应且经济高效地生成LED排列。平面和通孔电互连的喷墨打印对该工艺非常重要，因为它提供了一种将设备电互连的全数字方式，考虑了组件的实际位置并在空间上提供了不同的墨膜厚度。 Xaar的工业喷墨打印头用于分配指定体积的50 pL的银纳米颗粒墨水，以提供高可靠性和良好的定位精度，同时保持较低的卫星墨滴密度。以0.1 m / s的打印速度研究了特定的打印策略，以在与埋入式组件的通孔连接深度最大为50 um的情况下实现可靠的电连接。由于下面的基板的低玻璃化转变性质，需要较低的烧结温度以保持基板的机械性能。将讨论产生足够电导率以驱动40 mA电流的低温烤箱烧结。
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