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Investigations on the High Temperature Compatibility of Various Adhesion Layers for Platinum

机译：铂金各种粘附层的高温相容性研究

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In this paper we report on the high temperature compatibility of various adhesion layers for platinum (Pt) thin films. We investigated different adhesion layers, such as titanium (Ti), tantalum (Ta), aluminium nitride (AlN), aluminium oxide (Al_2O_3) and titanium oxide (TiO_2). All films were deposited on SiO_2/Si substrate by using the sputter technique. After deposition the films were annealed in air at 800 °C for different time lengths up to 16 hours. After annealing, Al_2O_3 and TiO_2 showed a dense oxide layer between Pt and SiO_2/Si and they seem to be suitable as adhesion layers for Pt at high temperatures. AlN is not suitable as adhesion layer for Pt at high temperatures. Ti and Ta are also not suitable forhigh temperatures, diffusing strongly into Pt layers and leading to the formation of oxide precipitates (TiO_x or TaO_x) in the Pt grain boundaries. In addition, the formation of Pt-crystallites (hillocks) on the surface was common in all the films.
机译：在本文中，我们报告了铂（Pt）薄膜各种粘合层的高温相容性。我们研究了不同的粘附层，例如钛（Ti），钽（Ta），氮化铝（AlN），氧化铝（Al_2O_3）和氧化钛（TiO_2）。通过溅射技术将所有薄膜沉积在SiO_2 / Si衬底上。沉积后，将薄膜在800°C的空气中退火长达16小时的不同时间长度。退火后，Al_2O_3和TiO_2在Pt和SiO_2 / Si之间显示出致密的氧化物层，似乎适合用作高温下Pt的粘附层。 AlN不适合用作高温下Pt的粘附层。 Ti和Ta也不适用于高温，它们会强烈扩散到Pt层中，并导致在Pt晶界形成氧化物沉淀（TiO_x或TaO_x）。另外，在所有膜中表面上均形成Pt微晶（小丘）。

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