Several generations of radiation hardened memory products were developed to support space applications. Both process technology enhancements and specialized design techniques were used to overcome the weaknesses of commercial memories when used in the space environment. The natural advancement of semiconductor technology was used to progressively increase density, enhance performance, and reduce power consumption. Historically, radiation hardened memories for space were fabricated at specialized foundries to achieve strategic levels of radiation hardness for both natural space and military applications. The demand for higher densities and lower cost, however, are pushing for design compatibility with state-of-the-art commercial foundries for 4M SRAM and beyond, and creating a new set of products targeting natural space. Advanced packaging technology is used to improve bit density and reduce weight, both of which are critical for space missions.
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