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Sn-3.0Ag-0.5Cu composite solder reinforced by multilayer graphene

机译：多层石墨烯增强Sn-3.0Ag-0.5Cu复合焊料

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摘要

A Sn-3.0Ag-0.5Cu (SAC) composite solder was fabricated by adding 0.1% weight percentage of multilayer graphene. The process steps are detailedly introduced in this paper. The physical, thermomechanical, wetting, mechanical properties were tested. Experimental results present that density and coefficient of thermal expansion of plain solder are higher than those of composite solder, while the thermal diffusion coefficient and wettability are improved after adding graphene. Besides, as expected, the addition of graphene has slight influence on melting temperature of SAC solder. Furthermore, the shear strength of solder ball joints was also improved more than 40% by adding graphene.
机译：通过添加0.1％重量百分比的多层石墨烯来制造Sn-3.0Ag-0.5Cu（SAC）复合焊料。本文将详细介绍这些处理步骤。测试了物理，热机械，润湿，机械性能。实验结果表明，普通焊料的密度和热膨胀系数高于复合焊料，而添加石墨烯后热扩散系数和润湿性得到改善。此外，正如预期的那样，石墨烯的添加对SAC焊料的熔化温度影响很小。此外，通过添加石墨烯，焊球接头的剪切强度也提高了40％以上。

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