• 主题
高级搜索  >
历史搜索 清空历史
首页> 外文会议>China Semiconductor Technology International Conference >No clean material for advance packaging assembly
【24h】

No clean material for advance packaging assembly

机译：没有用于提前包装组装的干净材料

获取原文
页面导航
  • 摘要
  • 著录项
  • 相似文献
  • 相关主题

摘要

Assembly process for most packages involves using some form of soldering material, either fluxes or solder pastes, to create a reliable solder joints. Flux, which is also part of the constituent of solder paste, is needed to remove the oxides from the interconnect surfaces, so that a reliable solder joint can be formed between the two metallic surfaces. Unfortunately, most of the fluxes leave certain amount of residue behind after the soldering process. This flux residue, if it's not cleaned properly, may interfere with the subsequent processes, e.g. the underfill or molding process. If the flux residue is not compatible with the underfill or molding material used, it may eventually cause delamination issue. On the other hand, as technology drives toward finer pitch components, combined with reduced bond line thickness or standoff of the IC packages, makes cleaning of flux residues more challenging. The shift towards using semiconductor-grade ultra-low residue no-clean fluxes or solder pastes, which eliminates the cleaning process, is therefore the solutions for overcoming these challenges. The flux residue left behind after soldering process is minimal, and compatible with the underfill or molding material used in the subsequent process. Besides, eliminating the cleaning process, will also help to reduce the total process time, cost and resources for the packaging assembly process. These are crucial factors for the IC packaging industry. This paper discusses the use of such ultra-low residue no-clean fluxes or solder pastes for various applications in the packaging industry.
机译：大多数封装的组装过程都涉及使用某种形式的焊接材料（助焊剂或焊膏）来创建可靠的焊点。需要焊剂（也是焊膏成分的一部分）以从互连表面除去氧化物，以便可以在两个金属表面之间形成可靠的焊点。不幸的是，大多数助焊剂在焊接过程后会留下一定量的残留物。如果未正确清洁，助焊剂残留物可能会干扰后续过程，例如底部填充或成型过程。如果助焊剂残留物与所用的底部填充材料或成型材料不兼容，则最终可能导致分层问题。另一方面，随着技术朝着更精细的间距元件发展，再加上减小的键合线厚度或IC封装的间距，使得清洗助焊剂残留物变得更具挑战性。因此，消除使用清洗工艺的半导体级超低残留免清洗助焊剂或焊膏的转变是克服这些挑战的解决方案。焊接过程后残留的助焊剂残留物极少，并且与后续过程中使用的底部填充材料或成型材料兼容。此外，省去清洗程序，也将有助于减少包装组装过程的总过程时间，成本和资源。这些是IC封装行业的关键因素。本文讨论了这种超低残留免清洗助焊剂或焊膏在包装行业中的各种应用。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱：kefu@zhangqiaokeyan.com

京公网安备：11010802029741号 ICP备案号：京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有

  • 客服微信

  • 服务号