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首页> 外文会议>Pan Pacific Microelectronics Symposium >Design for Manufacture and Test Using Thermal Cycling Under Bias to Measure Electrochemical Reliability on Bottom Terminated Components
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Design for Manufacture and Test Using Thermal Cycling Under Bias to Measure Electrochemical Reliability on Bottom Terminated Components

机译：偏置条件下使用热循环测量底部端接元件的电化学可靠性的制造和测试设计

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摘要

There are many factors contributing to electrochemical failures on electronic devices including pitch, electrical field, ionic contamination and environmental conditions. Each of these factors is dependent on the installation location, with exposure to varying temperatures and humidity. The interactions of all these factors are quite complex, and being able to predict potential electrochemical failures is challenging. A series of detection and preventive measures from the qualification of solder pastes to controlling the ionic contamination levels of the materials in production is needed. The purpose of this research is to characterize this problem by varying humidity and temperature conditions. Humid heat simulates the thermal load of the components under test at high humidity levels with cyclic temperature conditions. Condensation tests verify the design, materials, and remaining electronic circuit residues' resistance to moisture. The test methodology used for this research study will subject the test cards to humid heat and cyclic temperatures with frost conditions. The harsh environment simulates the thermal load including frost cycling to induce low dewing point conditions through cyclic temperature changes at high humidity. Humid environments challenge no-clean electronics and the basis for detecting electrochemical robustness at various points during the design validation testing.
机译：有许多因素会导致电子设备发生电化学故障，包括间距，电场，离子污染和环境条件。这些因素中的每一个都取决于安装位置，并暴露于变化的温度和湿度下。所有这些因素的相互作用都非常复杂，并且能够预测潜在的电化学故障具有挑战性。从锡膏的鉴定到控制生产中材料的离子污染水平，需要采取一系列检测和预防措施。这项研究的目的是通过改变湿度和温度条件来表征这个问题。湿热模拟在循环温度条件下高湿度条件下被测组件的热负荷。冷凝测试可验证设计，材料和剩余的电子电路残留物的耐湿性。用于本研究的测试方法将使测试卡经受潮湿的热和带有霜冻条件的循环温度。恶劣的环境模拟了包括霜冻循环在内的热负荷，以通过在高湿度下的周期性温度变化来诱发低露点条件。潮湿的环境对免清洗电子设备提出了挑战，也是在设计验证测试过程中在各个点检测电化学强度的基础。

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