A reliable die attach method for high power semiconductor lasersand optical amplifiers

机译：高功率半导体激光器的可靠管芯附着方法和光放大器

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We have developed a reliable, high yield, void-free method forsoldering high power semiconductor laser diodes epitaxy-side down. Wehave consistently obtained absolute thermal resistances as low at1.5° C/Watt and specific thermal resistances of 4·10-3 K·cm2/Watt on oxygen-free high conductivity(OFHC) copper heatsinks. This method has very wide process margins(75° C), exhibits excellent repeatability (4%), and is suitable forlaser die attach to diamond submounts

机译：我们已经开发出一种可靠，高产率，无空隙的方法大功率半导体激光二极管外延面朝下焊接。我们始终获得的绝对热阻低至 1.5°C / W的热阻和4·10 ^{-3
K·cm ^{2 / Watt在无氧的高电导率下
（OFHC）铜散热器。该方法具有很大的工艺裕度
（75°C），具有极好的可重复性（4％），适用于
激光管芯附着在金刚石底座上}}

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《Electronic Components and Technology Conference, 1995. Proceedings., 45th》||p.428-430|共3页
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Merritt S.A.; Heim P.J.S.; Cho S.; Dagenais M.;
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4. A reliable die attach method for high power semiconductor lasers and optical amplifiers [C] . Merritt, S.A., Heim, Electronic Components and Technology Conference, 1995. Proceedings., 45th . 1995

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A reliable die attach method for high power semiconductor lasersand optical amplifiers

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