The performance and reliability of a low-cost three-dimensionalplastic moulded vertical multi-chip module concept is presented.Performance was evaluated using custom designed chips incorporatingthermal, thermomechanical, electrical and reliability test structures.Results of performance are presented and are shown to correlate wellwith thermal, thermomechanical and electrical simulations. The thermaland thermomechanical performances are sufficient to allow use of theMCM-V technique in a wide range of applications without the need forspecial cooling techniques. Reliability testing to space level standardswas carried out on 53 technology demonstrator modules incorporating thetest chips and a high level of reliability has been demonstrated
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