New package prototyping is often a sequential process where thechip and system parameters are specified first, then the package designis initiated. A reduction in overall cycle time can be affected if theevents occur simultaneously. This study proposes a methodology foraddressing this issue. The method is outlined in the context ofprototyping the 119 plastic ball grid array (PBGA) package thermalperformance. The parameters influencing performance are system, deviceor package based. Ranges for the “yet-to-be-fixed”parameters are determined and factorial analyses used to yieldapproximate linear models with interactions for package performance.Once the device and system parameters are “fixed”, thelinear equations are solved simultaneously with junction and boardtemperature constraints to yield a design options map for package layout
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