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首页> 外文会议>Electronic Components and Technology Conference, 1995. Proceedings., 45th >Diffusion model to derate moisture sensitive surface mount ICs forfactory use conditions
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Diffusion model to derate moisture sensitive surface mount ICs forfactory use conditions

机译：扩散模型可降低湿气敏感的表面贴装IC的性能工厂使用条件

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Recent industry specifications JESD22-A112 and IPC-SM-786A haveidentified a set of moisture sensitivity levels for classification ofmoisture/reflow sensitive devices. The established test conditions aremeant to represent average worst case factory environmental conditionsthat a plastic packaged surface mount IC can safely be exposed to afteropening of the protective dry-bag. The exposure times imposed by thelevel classifications relate specifically to the equivalent testingcondition, e.g., a Level 3 device must be assembled within 168 hours fora factory environment of 30° C/60%RH. No equivalent exposure timesare addressed by the specifications if the factory ambients are not at30° C and 60%RH. This paper addresses the issue of equivalentexposure times for varying temperature-humidity conditions that afactory could maintain. A “derating” procedure has beendeveloped that adopts a first principles approach for solution tomoisture diffusion into plastic packages. 1-D and 3-D mathematical andcomputer generated solutions for moisture diffusion were obtained forplastic packaged ICs. Critical moisture concentrations achieved duringJEDEC/IPC testing conditions at internal interfaces were calculated andused as a criterion for the “derating” procedure. Based onthis approach, an equivalency table can be developed for any combinationof factory temperature and humidity conditions
机译：最新的行业规范JESD22-A112和IPC-SM-786A具有 确定了一组湿气敏感度等级，用于分类 潮湿/回流敏感设备。建立的测试条件是 旨在代表平均最坏情况下的工厂环境条件 塑料封装的表面贴装IC可以安全地暴露在 打开干燥保护袋。暴露时间 级别分类专门与等效测试有关 条件，例如，必须在168小时内组装3级设备 30°C / 60％RH的工厂环境。没有等效的曝光时间 如果工厂环境不符合要求，则可以通过规范解决 30°C和60％RH。本文解决了等效问题 各种温度和湿度条件下的暴露时间为 工厂可以维护。 “降级”程序已经 开发采用第一原理方法来解决 水分扩散到塑料包装中。一维和三维数学和 获得了计算机生成的水分扩散解决方案，用于 塑料封装的IC。期间达到的临界水分浓度 计算了内部接口的JEDEC / IPC测试条件，并 用作“降级”过程的标准。基于 通过这种方法，可以为任何组合开发等效表 工厂的温度和湿度条件

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