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首页> 外文会议>Electronic Components and Technology Conference, 1995. Proceedings., 45th >A new laminate material for high performance PCBs: liquid crystalpolymer copper clad films
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A new laminate material for high performance PCBs: liquid crystalpolymer copper clad films

机译：新型用于高性能PCB的层压材料：液晶聚合物覆铜薄膜

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We have all heard that the primary drivers that are moving theelectronics industry can be summarized in three words: faster, smaller,lighter. Many laminate materials have been developed in the history ofthe electronics industry and each has been designed to providedesigners, fabricators and OEMs with interconnects that would satisfythis paradigm. However, as densities increase the demands placed onlaminate materials are beginning to approach the limits of some of thesematerials. To meet manufacturer's needs, new materials must becontinually developed to meet the demands of the electronics industry.This paper discusses a newly developed material consisting of a highperformance liquid crystal polymer (LCP) laminated to copper foil. LCPsoffer a balance of properties unmatched by other engineering or highperformance resins. Some of the advantages offered by the LCP copperclad film include: low dielectric constant; very low moistureabsorption; laser hole formation; processing similar to standard FR-4materials; and chemical resistance. Also, this paper discusses theevaluation of multilayer PCB fabricated with liquid crystal polymercopper clad film. The evaluation included peel strength, solder floattesting, moisture absorption and moisture and insulation resistancetesting. The result of this work was the production of a functionalPCMCIA card
机译：我们都听说，正在推动 电子行业可以概括为三个词：更快，更小， 打火机。在历史上已经开发了许多层压材料。 电子行业，每个都旨在提供 设计人员，制造商和OEM拥有能够满足互连要求的互连 这种范式。但是，随着密度的增加，对 层压材料开始接近其中一些极限 材料。为了满足制造商的需求，必须使用新材料。 不断发展以满足电子行业的需求。 本文讨论了一种由高 高性能液晶聚合物（LCP）层压到铜箔上。 LCP 提供其他工程无法比拟或高级的性能平衡 高性能树脂。 LCP铜缆提供的一些优势 覆膜包括：低介电常数;水分极低 吸收激光孔形成;类似于标准FR-4的处理 材料;和耐化学性。此外，本文讨论了 液晶聚合物制备的多层印刷电路板的评价 覆铜膜。评估包括剥离强度，焊料浮起 测试，吸湿性和防潮性和绝缘性 测试。这项工作的结果是产生了一个功能 PCMCIA卡

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