Compact optical module packages for use as 156 Mbps opticalinterfaces have been developed by incorporating passive alignmenttechniques. In this approach, a laser chip and a fiber are aligned on aV-grooved silicon substrate by flip-chip bonding. The silicon substrateshave been fabricated by conventional silicon processing andmicro-machining technologies. A new feature of our fabrication techniqueis to implement a self-alignment principle for the formation ofV-grooves and solder bumps, which eliminates a registration error fromthe individual process. The laser diode and photo diode submodules,assembled on silicon substrates, exhibited 4-6% and about 80% couplingefficiencies, respectively. The fabricated proto-type transmitter andreceiver module packages have a very compact size of 5 cc each andshowed adequate performance satisfying the requirement for opticalsubscriber transmitter and receiver modules
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