首页> 外文会议>Electronic Components and Technology Conference, 1995. Proceedings., 45th >Optimal design of an inter-board strain-relief for high-reliabilitysurface mount attachment
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Optimal design of an inter-board strain-relief for high-reliabilitysurface mount attachment

机译:高可靠性的板间应力消除的优化设计表面贴装附件

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The long-term reliability of surface mount (SM) interconnectionsremains an important issue in many electronics packaging technologies.Strain-reliefs with sufficient compliance can minimize the cyclic loadsimpressed on SM solder connections during operational temperatureexcursions, appreciably increasing the margin for long-term attachmentreliability. Compliance evaluation was performed for an inter-boardstrain-relief, or bond-strap, in a commercial Low-Noise Amplifier (LNA)used in various AT&T wireless transmission systems. The bond-strapcompliance was optimized, within practical forming and assemblyconstraints, to provide robust SM interconnection during the expectedproduct service life
机译:表面贴装(SM)互连的长期可靠性 仍然是许多电子封装技术中的重要问题。 足够顺从的应力消除可以最大程度地减少循环载荷 在工作温度期间给SM焊接连接留下了深刻的印象 远足,大大增加了长期依恋的余地 可靠性。进行了板间合规性评估 商用低噪声放大器(LNA)中的应力消除或键带 用于各种AT&T无线传输系统。绑带 在实际的成型和组装过程中对合规性进行了优化 约束,以在预期的时间内提供可靠的SM互连 产品使用寿命

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