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首页> 外文会议>Electronic Components and Technology Conference, 1995. Proceedings., 45th >Development of GE's plastic thin-zero outline package (TZOP)technology
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Development of GE's plastic thin-zero outline package (TZOP)technology

机译：GE塑料薄零轮廓封装（TZOP）的开发技术

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One of the major obstacles impeding the wide spread use ofmultichip technology in the commercial electronics industries is theprocurement and yield of bare chips. This area includes the reluctanceof IC manufactures to supply bare chips due to the lack of standards,the difficulties associated with testing bare chips and their lack ofconfidence in the abilities of the MCM fabricators to assemble barechips into MCMs without damaging good parts. Another aspect of dieprocurement is that bare chips are not generally available in TAB orflip-chip solder bump configurations. A highly flexible multichipinterconnect approach has been developed with un-matched performanceadvantages that will be applicable to a wide range of commercialapplications. Quick turn prototyping is made easy with masklessprocessing, electronic data entry, and integrated CAD CAM environmentfrom customers, to engineering, to procurement and to manufacturing.This technology provides the highest density electronic packaging withits edge to edge chip spacing, its top mounted component capability andits 3D stacking and substrate thinning options. The basic electronicinterconnection technology involves: plastic encapsulated single ormultichip modules; flexible, conformable multichip on flex assemblies;non-planar single or multichip modules molded into conformal surfaces;and ball grid array MCM assemblies. These interconnect structures willbe applied to digital, RF, analog, power conversion and mixed modecircuits
机译：阻碍人们广泛使用的主要障碍之一 商业电子行业中的多芯片技术是 裸芯片的采购和产量。这方面包括勉强 缺乏标准的IC制造商提供裸芯片， 与测试裸芯片相关的困难及其缺乏 对MCM制造商裸露组装的能力充满信心 芯片插入MCM，而不会损坏良好的零件。死亡的另一方面 采购是在TAB中通常不提供裸芯片或 倒装焊锡凸点配置。高度灵活的多芯片 已开发出具有无与伦比性能的互连方法 适用于各种商业的优势 应用程序。无掩膜使快速转弯原型制造变得容易 处理，电子数据输入和集成的CAD CAM环境 从客户到工程，从采购到制造。 这项技术提供了密度最高的电子包装， 边缘到边缘的芯片间距，顶部安装的组件功能以及 其3D堆叠和基板减薄选项。基本电子 互连技术涉及：塑料封装的单层或多层 多芯片模块;柔性组件上的柔性，合格多芯片; 将非平面的单芯片或多芯片模块模制到保形表面中; 和球栅阵列MCM组件。这些互连结构将 适用于数字，射频，模拟，功率转换和混合模式 电路

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