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Temperature dependent mechanical behavior of plastic packagingmaterials

机译:塑料包装的温度依赖性机械性能材料

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This paper outlines sample preparation methodology and providesmechanical property data for commonly used plastic packaging materials.Included are die attach epoxies, mold compounds, liquid encapsulants(glob top material), printed circuit board laminate, and solder mask.Elastic modulus and thermal expansivity were characterized in thetemperature range between -65° C and 260° C. Where possible, datawere measured on samples cut from actual product to account for anymicrostructural effects that are process dependent. If special sampleshad to be fabricated, they were first subjected to the temperatureprofiles expected in actual manufacturing processes before being tested.The main effect of these added thermal exposures was to increase theglass transition temperature
机译:本文概述了样品制备方法并提供了 常用塑料包装材料的机械性能数据。 包括管芯附着环氧树脂,模塑料,液体密封剂 (球状顶部材料),印刷电路板层压板和阻焊膜。 弹性模量和热膨胀率在 温度范围介于-65°C和260°C之间。如果可能,数据 从实际产品中抽取的样品进行测量,以计入任何 与过程有关的微观结构效应。如果有特殊样品 必须被制造出来,他们首先要经受温度 在测试之前在实际制造过程中预期的轮廓。 这些增加的热暴露的主要效果是增加了 玻璃化温度

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