首页> 外文会议>Electronic Components and Technology Conference, 1995. Proceedings., 45th >Design of a compact, high speed optical transceiver using two stepovermolding
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Design of a compact, high speed optical transceiver using two stepovermolding

机译:分两步设计紧凑型高速光收发器包覆成型

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A low cost, compact optical transceiver has been designed foremerging FDDI and Fiber Channel Local Area Networks (LANs). Thistransceiver has been designed to meet the growing volumes and rapidlyfalling prices in the FDDI marketplace. The package is designed to befully compliant with an industry standard package outline and footprint.This optical data link (ODL) contains a duplex SC connectorreceptacle-compatible with the ANSI Fiber Channel and low cost FDDIstandards. With a single row of 9 pins, the transceiver will occupy lessthan 1.0 square inch of board space. This ODL transceiver has beendesigned using two step overmold packaging technology. This technologyintegrates optical and electrical components in a single, sealed,transfer molded package. This package design uses copper based leadframeto provide low cost interconnection and mass handling. The finalassembly sequence was conceived using the latest Design for Simplicity(DFS) principles. This paper describe the design concept and challengesrequired to implement a full transceiver in such a small size. Thermalanalysis results are discussed. Electrical design issues such ascross-talk and external noise immunity are also described. Initialperformance results using preliminary design models are reported
机译:低成本,紧凑的光收发器已设计用于 新兴的FDDI和光纤通道局域网(LAN)。这 收发器旨在满足不断增长的数量和迅速增长的需求 FDDI市场价格下跌。该包装被设计为 完全符合行业标准的封装外形和尺寸。 该光学数据链路(ODL)包含一个双工SC连接器 插座兼容ANSI光纤通道和低成本FDDI 标准。通过单排9针,收发器将占用更少的空间 大于1.0平方英寸的电路板空间。该ODL收发器已 设计采用两步包覆成型包装技术。这项技术 将光学和电气组件集成在一个密封的, 传递模塑包装。该封装设计使用铜基引线框架 提供低成本的互连和批量处理。决赛 使用最新的“简约设计”构想了装配顺序 (DFS)原则。本文介绍了设计概念和面临的挑战 需要以如此小的尺寸实现完整的收发器。热的 分析结果进行了讨论。电气设计问题,例如 还描述了串扰和外部噪声抗扰性。最初的 报告使用初步设计模型的性能结果

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