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Solder-paste inspection by structured light methods based on phase measurement

机译：基于相位测量的结构光学方法的焊膏检查

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Solder paste inspection, i.e. reconstruction of the 3D shape of the solder paste printed on surface mount technology component pads, is a major inspection task in the printed circuit board manufacturing process. We have investigated the use of machine vision methods based on structured light and phase measurement for on-line solder paste inspection. With these methods a periodic light pattern is projected onto the object and imaged by a camera from a different viewpoint. Since the imaged pattern is phase-modulated according to the topography of the object, suitable phase- extraction techniques enable reconstruction of the 3D shape. In a previous paper we have shown that the Fourier-based phase-extraction technique allows recovery of the 3D shape of solder paste on pads but is too slow for effective on- line inspection. In this paper we describe a new profilometry technique which uses a fast demodulation scheme and simple DSP operators such as comb filters and moving averages. Experimental results show that the new technique is equivalent to the Fourier technique with respect to reconstruction of the 3D shape of solder paste and computation times measurements indicate that it is roughly 20 times faster.
机译：焊膏检查，即重建在表面贴装技术部件垫上印刷的焊膏的3D形状，是印刷电路板制造工艺中的主要检查任务。我们研究了基于结构光和相位测量的机器视觉方法的使用，用于在线焊膏检查。利用这些方法，将周期性光图案投射到对象上并由相机从不同的视点上成像。由于成像图案根据物体的形貌进行相位调制，因此合适的相位提取技术能够重建3D形状。在前一篇论文中，我们已经表明，傅立叶的相位提取技术允许在焊盘上恢复焊膏的3D形状，但对于有效的陆线检查来说太慢。在本文中，我们描述了一种使用快速解调方案和简单的DSP运算符（如梳状滤波器和移动平均值）的新型轮廓测量技术。实验结果表明，新技术相当于关于焊膏的3D形状的重建和计算时测量的傅里叶技术表明它的速度大约为20倍。

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