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Process Optimization of Perpendicular Magnetic Tunnel Junction Arrays for Last-Level Cache beyond 7 nm Node

机译:垂直磁隧道结阵列的工艺优化,用于超过7 nm节点的最后一级缓存

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This paper demonstrates systematic process optimization of perpendicular magnetic tunnel junction (pMTJ) by hardware, unit-process, and material stack design. TMR of 200% at RA 5 Ohm·μm2, HSAF ~ 8 kOe, and 10-time tunability of Hc were achieved at the film level. After patterning, 10-6 write error rate was reached at 0.4 pJ, VBD was as high as 1600 mV at 20 ns pulse width, and excellent device stability against 400°C BEOL baking was demonstrated. The device performance along with the process capability to make MTJ array at 88 nm pitch provides opportunities for LLC applications.
机译:本文通过硬件,单元过程和材料堆栈设计演示了垂直磁隧道结(pMTJ)的系统过程优化。在RA 5 Ohm·μm处的TMR为200% 2 , H SAF 在薄膜水平上获得了约8 kOe的Hc和10倍的Hc可调性。图案化后,10 -6 写入错误率达到0.4 pJ,V BD 脉冲宽度为20 ns时,其最高为1600 mV,并且证明了在400°C的BEOL烘烤下具有出色的器件稳定性。器件性能以及以88 nm间距制造MTJ阵列的工艺能力为LLC应用提供了机会。

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