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8LPP Logic Platform Technology for Cost-Effective High Volume Manufacturing

机译：8LPP逻辑平台技术，可实现经济高效的批量生产

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8LPP logic platform technology supports mobile and high-performance and lower power application especially for mobile, artificial intelligence (AI), and cryptocurrency devices. 8LPP is employing the evolutionary generation of bulk FinFET FEOL and 44nm EUV-less multi-patterning BEOL process, resulting in 7% power reduction and ~15% area scaling compared with the previous 10LPP. The cost-effective high volume manufacturing is achieved with the minimum additional critical layers and the comparable process steps over the current high volume 10nm production.

机译：8LPP逻辑平台技术支持移动，高性能和低功耗应用，尤其是针对移动，人工智能（AI）和加密货币设备的应用。 8LPP采用了进化的大尺寸FinFET FEOL和44nm-less-EUV多图案BEOL工艺，与以前的10LPP相比，功耗降低了7％，面积缩小了约15％。在目前的10nm大批量生产中，只需最少的额外关键层和可比的工艺步骤，即可实现具有成本效益的大批量生产。

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《IEEE Symposium on VLSI Technology》|2018年|217-218|共2页
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Hwasung Rhee; Ilryong Kim; Jaehun Jeong; Nakjin Son; Heebum Hong; Sungil Cho; Yongmin Park; Dongwoo Kim; Yunki Choi; Jeonghoon Ahn; Sung Gun Kang; Kyunghwan Yeo; Jungtae Kim; Euncheol Lee; Jong Mil Youn; Jong Shik Yoon;
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关键词
Computer architecture; Logic gates; Performance evaluation; Gain; Production; FinFETs; Microprocessors;

机译：计算机体系结构;逻辑门;性能评估;增益;生产; FinFETs;微处理器;

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8LPP Logic Platform Technology for Cost-Effective High Volume Manufacturing

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