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Dynamic Visualizations of Flow and Meniscus for Quadrilateral Bump Arrangement in Capillary Underfill Process

机译:毛细管底部填充过程中四边形凸块布置流动和半月板的动态可视化

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This study has investigated the dynamic variations of flow and meniscus during underfill process using flow visualization technique to understand physics of underfill flows. As a quantitative flow visualization technique, μ-PIV(micro particle image velocimetry) was applied. Glycerin was filled into a glass chip which has quadrilateral bump arrangement. It was found that the wetting distance increases rapidly when the meniscus attaches onto the bump and it increases slowly when the meniscus detaches from the bump. The contact angle and the meniscus velocity are in-phase according to the meniscus position. The flow velocity is the fastest between bumps when the meniscus is detached and then the flow velocity continuously gets slow down.
机译:本研究通过流动可视化技术研究了底部填充过程中的流动和半月板的动态变化,以了解底部填充流的物理学。作为定量流动可视化技术,施加μ-PIV(微颗粒图像速度)。甘油填充到具有四边形凸块装置的玻璃芯片中。发现当弯月面附着在凸起上时,润湿距离迅速增加,并且当弯月面从凹凸开始时,它会缓慢增加。根据弯月面位,接触角和弯月液速度是相位的。当弯月面拆卸时,流速是颠簸之间的最快,然后流速连续变慢。

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