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Fabrication of high-performance, leaded, ceramic-chip carriers using a photoformable gold conductor

机译：使用可光可规化的金导体制造高性能，铅，陶瓷芯片载体

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摘要

A photosensitive gold conductor was used to fabricate a high I/O

机译：使用光敏金导体用于制造高I / O.

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《Electronics Components Conference》|1988年||共4页
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作者
Roeder P.J.; Dorfman J.R.; Institute of Electric and Electronic Engineer;
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中图分类自动化技术、计算机技术;
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Fabrication of high-performance, leaded, ceramic-chip carriers using a photoformable gold conductor

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