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Ultrahigh-precision metrology on masks for 0.25 um device generation

机译:掩模的超高精度计量0.25 UM器件生成

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Metrology becomes more and more a key function in mask making and development of new technologies. Due to the Sematech strategy a precision performance of less than 9 nm (3$sigma@) will be mandatory for the pattern placement and CD metrology tools for masks of the 0.25 $mu@m device generation. Performance data below 9 nm demonstrate the capability of today's metrology systems for this application. On phase shift masks (PSM) the pattern placement metrology tool should be able to measure the positions of the structures of both layers, the phase shifter and the chromium. Measurement data obtained with the LMS 2020 on embedded attenuated PSMs as well as results on Levenson type PSMs demonstrate the excellent applicability of optical metrology systems in this field. Cost of ownership (COO) of the metrology tool is another important issue to be reviewed. Currently more and more purchasing decisions among competing tools of similar performance are based on the COO comparison.
机译:Metrologology变得越来越多的掩码制作和开发新技术的关键功能。由于SemaTech Strateget策略,对于0.25 $ MU @ M器件生成的MASKS的模式放置和CD计量工具,将强制执行低于9nm(3 $ sigma @)的精度性能。低于9 NM的性能数据证明了当今本申请的计量系统的能力。在相移掩模(PSM)上,图案放置计量工具应该能够测量两层,相移器和铬的结构的位置。用LMS 2020在嵌入的衰减PSM上获得的测量数据以及Levenson型PSM的结果证明了该领域中光学计量系统的优异适用性。计量工具的所有权成本(COO)是待审查的另一个重要问题。目前越来越多的采购决策在相似性能的竞争工具之间是基于COO比较。

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