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Stress intensity factor analysis for an interface crack between dissimilar isotropic materials under thermal stress

机译:热应力下不同各向同性材料裂缝的应力强度因子分析

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摘要

Thermal stresses, one of the most important causes of interfacial failure between dissimilar materials, arise from different coefficients of linear thermal expansion. An efficient numerical procedure in conjunction with the finite element method (FEM) for the stress intensity factor (SIF) analysis of interface cracks under thermal stress is presented. The crack closure integral method is modified using the superposition method. The SIF anlyses of some interface crack problems under mechanical and thermal loads are thermal loads are demonstrated. Very accurate mode separated SIF's are obtained.
机译:热应力是不同材料之间的界面失效的最重要原因之一,来自不同的线性热膨胀系数。提出了一种高效的数值步骤,其呈现了热应力下界面裂缝的应力强度因子(SIF)分析的有限元方法(FEM)。使用叠加方法修改裂缝闭合积分方法。在机械和热负荷下的一些界面裂纹问题的SIF裂缝是热负荷。获得非常精确的模式分离的SIF。

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