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首页> 外文会议>Japan International SAMPE Symposium >An Analytical Study of Thermal Conductivity Affecting Thermoelastic Stress Measurement of Laminate Composites
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An Analytical Study of Thermal Conductivity Affecting Thermoelastic Stress Measurement of Laminate Composites

机译：影响层压复合材料热弹性应力测量的热导率的分析研究

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摘要

Thermoelastic stress measurement is a useful nondestructive evaluation technique that can be in-situ applied. In order to apply it quantitatively to composite laminates, thermal conduction from inner layer and in-plane conduction of surface layer affecting thermoelastic stress measurement was examined in this paper. The reason of this heat conduction can be ascribed to the fact that each layer generates different levels of heat by the thermoelastic effect. Two-dimensional finite element analysis was conducted here to evaluate this heat conduction effect. Consequently, it was clarified that thermoelastic stress measurement could be quantitatively applied to conventional stacking sequences of laminate composites. It was also obtained that thermoelastic stress measurement data must be carefully dealt with if the surface layer generates relatively low heat thermoelastically.
机译：热弹性应力测量是一种有用的非破坏性评估技术，可以采用原位应用。为了定量地应用于复合层压板，本文研究了影响热弹性应力测量的内层的热导通和表面层的面内传导。这种热传导的原因可以归因于通过热弹性效果产生不同水平的热量。在此进行二维有限元分析以评估这种导热效应。因此，阐明了热弹性应力测量可以定量应用于常规的层压复合材料的常规堆叠序列。还可以获得，如果表面层产生相对低的热量，则必须仔细地处理热弹性应力测量数据。

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