We present the first report of a fully integrated multilayer organic (MLO)-based transmitter module incorporating a single MMIC for WLAN applications. We report the design and measurement of a C-band upconverter MMIC with excellent LO and image rejection as well as wideband operation fabricated in a commercial GaAs MESFET process. This development of a complete module also includes a miniaturized integrated square patch resonator band pass filter (BPF) with inset feed lines fabricated in MLO packaging technology. This realizes a compact and highly integrated transmitter module suitable for the low cost network interface card (NIC), IEEE 802.11a WLAN applications in 5- 6 GHz frequency band. This transmitter module demonstrates the feasibility of developing a miniature high performance and highly integrated wireless system on package (SOP)-based solutions.
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