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Effect of Impurities in the Breaking of Gold Nanowires

机译:杂质在金纳米线破碎的影响

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Using ab initio Density Functional Theory total energy calculations, we study the influence of H, B, C, N, O, and S in the rupture of a gold nanowire. In particular, using an as realistic as possible model for a suspended gold nanowire under stress, we observe that the Au wire always break at an Au-Au bond, with a maximum bond length between 3.0 and 3.1 A. Therefore, the experimentally observed large Au-Au bonds before the rupture of the nanowire (≈ 3.6 A) is probably due to the presence of light impurities (X) forming Au-X-Au bonds. We obtain that the Au-Au maximum distance for X equals C or N is of the order of 3.9 A, whereas for B and O it is of the order of 4.1 A. On the other hand, H this maximum distance before the rupture of the wire is approximately 3.6 A, being the best candidate to explain the experimental results. An experimentally observed very large Au-Au bond of 4.8 A is probably caused by an Au-S-Au structure, since we obtain for this configuration an Au-Au distance of ≈4.7 A.
机译:使用从头密度泛函理论的总能量的计算,我们研究在金纳米线的破裂的H,B,C,N,O,和S的影响。特别是,使用作为现实作为在应力作用下悬浮金纳米线可能的模式,我们观察到在Au线总是在一个金 - 金键断裂,用因此,实验观察到的大的3.0和3.1 A.之间的最大键长所述纳米线(≈3.6 A)的断裂前金 - 金键可能是由于形成的Au-X - 金键轻杂质(X)的存在。我们得到的X的金 - 金的最大距离等于C或N为3.9的数量级,而对于B和O是4.1 A.在另一方面的顺序,H的破裂前该最大距离导线是约3.6 A,为解释的实验结果的最佳人选。 4.8 A的实验中观察到非常大的金 - 金键可能是由为Au-S-Au结构造成的,因为我们得到这种构造≈4.7A的金 - 金距离

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