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Dissipation mechanism in 3D collisionless magnetic reconnection

机译:3D碰撞磁重构的耗散机制

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Dissipation processes responsible for fast magnetic reconnection in collisionless plasma are investigated using 3D electromagnetic particle-in-cell simulations. The present study compares two simulation runs; one with small system size in the current density direction, and the other with larger system size. In the case with small system size, the reconnection processes are almost the same as those in 2D reconnection, while in the other case the drift kink mode evolves along the current density and deforms the current sheet structure drastically. Although fast reconnection is achieved in both the cases, it is found that the dissipation mechanism is very different between them. In the case without kink mode, the electrons transit the electron diffusion region without thermalization, so that the magnetic dissipation is supported by the inertia resistivity alone. On the other hand, in the kinked current sheet, the electrons are not only accelerated in bulk, but they are also partly scattered and thermalized by the kink mode, which results in the anomalous resistivity in addition to the inertia resistivity. It is discussed that in 3D reconnection the thickness of the electron current sheet becomes larger than the local electron inertia length.
机译:使用3D电磁粒子仿真研究负责在碰撞等离子体中的快速磁性重新连接的耗散过程。本研究比较了两个模拟运行;一个具有小型密度方向的系统尺寸小,另一个具有较大的系统尺寸。在系统尺寸小的情况下,重新连接过程与2D重新连接的重新连接几乎相同,而在另一个情况下,漂移扭结模式沿电流密度演变,并且大大变形了当前的纸张结构。虽然在这种情况下实现了快速重新连接,但发现它们之间的耗散机制非常不同。在没有扭结模式的情况下,电子传输电子扩散区域而不热化,从而通过单独的惯量电阻率支撑磁化。在另一方面,在当前扭结片,电子不仅加速散装的,但它们也部分地由扭结模式,分散和热化,其结果在除了惯性电阻率异常电阻率。讨论认为,在3D重新连接中,电子电流片的厚度变大于局部电子惯性长度。

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