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Machining effect of vibration electrochemical polishing (VECP)

机译：振动电化学抛光的加工效果（VECP）

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Electrochemical polishing (ECP) has contributed in many areas. However, in conventional ECP, impurities in the material or outside influences may leave micropits in the surface during machining. These micropit surface defects degrade the quality and durability of the machined surface. Recently, much attention has focused on vibration electrochemical polishing (VECP) in an attempt to improve surface quality. However, the material removal rate (MRR) has yet to be verified for VECP. In this study, we examined and compared the MRR and material removal properties of ECP and VECP, using current density measurements. The machined surface was measured using surface profiling software. Our results indicated a significant improvement in the amount of material removed with VECP, compared with ECP.
机译：电化学抛光（ECP）在许多领域贡献。然而，在常规的ECP中，材料中的杂质或外部影响可能在加工过程中留在表面中的微米。这些微量表面缺陷降低了加工表面的质量和耐久性。最近，很多关注都集中在振动电化学抛光（VECP）上，以提高表面质量。但是，材料去除率（MRR）尚未验证VECP。在本研究中，我们使用电流密度测量检查并比较了ECP和VECP的MRR和物质去除特性。使用表面分析软件测量加工表面。我们的结果表明，与ECP相比，用VECP除去的材料量显着改善。

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