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首页> 外文会议>International Conference on Fracture >The scattering of SH wave from a crack in a piezoelectric substrate bonded a half-space of functionally graded materials
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The scattering of SH wave from a crack in a piezoelectric substrate bonded a half-space of functionally graded materials

机译：来自压电基板中的裂缝的SH波的散射粘接到功能渐变材料的半空间

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摘要

The scattering of SH wave by a crack in a piezoelectric substrate which bonded to a half-space of functionally graded materials (FGM) is studied. The governing equations along with permeable crack boundary, regularity and continuity conditions across the interface are reduced to a coupled set of cauchy singular integral equations . The Cauchy singular integral equations can be solved by the approximation of Chebyshev polynomials. Numerical results for the normalized dynamic stress intensive factors(NDSIF) and the normalized electric dis-placement intensive factors (NEDIF) are carried out for an example. The effects of geometric parameters, physical parameters and the effects of frequency and angels of SH wave on the NDSIF and the NEDIF are analyzed.
机译：研究了在压电基板中裂缝的Sh波的散射，该压电基板上结合到功能梯度材料（FGM）的半空间。控制方程以及界面上的透水裂缝边界，规律性和连续性条件减少到耦合的Cauchy奇异积分方程。 Cauchy奇异积分方程可以通过Chebyshev多项式的近似来解决。为一个例子进行了归一化动态应力密集型因子（NDSIF）和归一化电解放置强度因子（NEDIF）的数值结果。分析了几何参数，物理参数和Sh波的频率和天使效应的影响，在NDSIF和NEDIF上进行了影响。

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