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The Influence of Ultra Fine Solder Powder Related to Wafer Bumping within the Ultra Fine Pitch Arena

机译：超细焊粉与晶圆撞击内的超细焊粉在超细校长内的影响

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Besides the plating process Solder Paste Printing is the most commonly applied production method to electrically connect components and carrier systems. This technology is a proven and stabilized technology serving a worldwide spectrum of applications. The continuously proceeding demand for miniaturization of components, PCBs and completed modules seems to be opposite to the request on larger scale of functionality, higher efficiency and more powerful ICs in general, specifically on memory chips. This leads to smaller pitches both on PCBs as well as on chip level. Today pitches smaller than 100μm already are standard to the industry. Therefore an advanced Solder Paste Printing Process had to be adjusted to a competitive level. A vital part of this success became the smallest possible powder particle grain sizes combined with repeatable soldering properties.
机译：除了电镀工艺焊膏，印刷是电连接部件和载体系统的最常用的生产方法。该技术是一项经过验证的和稳定的技术，提供了全球应用的应用。组件，PCB和完成模块的小型化的不断进行需求似乎与更大规模的功能，更高效率和更强大的IC的请求相反，专门针对内存芯片。这导致PCB上的较小间距以及芯片水平。今天的投球量小于100μm已经是行业的标准。因此，必须将先进的焊膏印刷过程调整为竞争水平。这一成功的重要部分成为最小的粉末粒子尺寸，与可重复焊接性能结合。

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