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Effect of Indium on Bonding between Porcelain and Au-Pt-Cu Alloy

机译：铟对瓷与Au-Pt-Cu合金键合的影响

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摘要

Effects of 0.5 wt% Indium addition on the oxidation of Au-Pt-Cu alloy, the interfacial microstructure and bonding strength between porcelain and Au-Pt-Cu-xIn alloys(x = 0, 0.5wt%) were investigated using scanning electron microscopy, X-ray diffractometry, transmission electron microscopy, and a tensile tester. The bonding strength of the Au-Pt-Cu and Au-Pt-Cu-0.5In alloys with porcelain was about 24.6 MPa and 49.5 MPa in average, respectively. This higher bonding strength in the Au-Pt-Cu-0.5In alloy compared with the Au-Pt-Cu alloy without In is ascribed to the formation of In_2O_3 at the interface between porcelain and Au-Pt-Cu-0.5In alloy. Especially, the formation of In_2O_3 at the interface between porcelain and Au-Pt-Cu-0.5In alloy leads to enhancing chemical bonding between In_2O_3 and various oxides in porcelain, and also to improving the anchoring effect.
机译：使用扫描电子显微镜研究0.5wt％铟添加对Au-Pt-Cu合金氧化的氧化氧化，瓷和Au-Pt-Cu-xin合金（x = 0,0.5wt％）的抗粘接强度，X射线衍射术，透射电子显微镜和拉伸试验机。 AU-PT-Cu和Au-Pt-Cu-0.5英寸合金的粘合强度分别为约24.6MPa和49.5MPa。与无需In的Au-Pt-Cu-0.5英寸合金相比，在Au-Pt-Cu-0.5英寸合金中的这种较高的粘合强度与瓷和Au-Pt-Cu-0.5英寸合金之间的界面中的In_2O_3的形成归因于in_2O_3。特别地，在瓷和Au-Pt-Cu-0.5英寸合金之间的界面处形成In_2O_3导致在瓷器中的in_2O_3和各种氧化物之间增强化学键合，以及改善锚固效果。

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