In summary, MC calculations are used in conjunction with EAM interatomic potential to study the sliding and migration of Σ 5 tilt GB in copper at both elevated and zero temperature. It has been found that the SA approach reduces the GB sliding energy barrier by about a factor of 2 but interface mobility is insensitive at the annealing temperature. This contrasts with our precious results for aluminium, where we found GB mobility sensitive at the temperature, mediated by atom at second layer. Several points stand out from these results. First, there is an important difference on the energy profile across the interface in copper and aluminium. The energy minimum for the atom at the second layer is crucial for the thermal dependency of GB migration. Second, and more significant, is that copper is more sensitive to the plastic deformation, even at zero temperature. However, low mechanical strength does not allow use pure copper in the presence of mechanical loads.
展开▼
