• 主题
高级搜索  >
历史搜索 清空历史
首页> 外文会议>International Postgraduate Conference on Mechanical Engineering >Effect of fibre-lasers parameters on interfacial reaction and wetting angle of two different types of SAC305 solder fabrication on Cu pad
【24h】

Effect of fibre-lasers parameters on interfacial reaction and wetting angle of two different types of SAC305 solder fabrication on Cu pad

机译：纤维激光参数对Cu垫两种不同类型SAC305焊料制造的界面反应和润湿角度的影响

获取原文
页面导航
  • 摘要
  • 著录项
  • 相似文献
  • 相关主题

摘要

This paper presents the effect of different parameters of fibre laser soldering on interfacial reaction of two types of lead-free solder fabrication on Cu pad.The objective of this paper is to study the intermetallic compound thickness(IMC)formation and wetting angle of two different types of solder fabrication when it was exposed to varies of laser power and scanning time.A fibre laser with 200W continues wave(CW)was used in this experiment to form a joining between SAC305 solder wire and printed copper board.A continuous laser power was ranged between 72W to 88W and scanning time of 1.5s and 2.5s were chosen to create joining.Flux was used in the laser soldering experiment in order to gain uniform heat distribution throughout the solders.The mechanical properties were observed by using optical and metallurgical microscope.Results showed that SAC305 solder powder performing good wetting angle with smallest value of 18.18° meanwhile,the smallest wetting angle for solder wire is 26.12° and in terms of IMC layer comparison,solder powder has more thinner IMC layer with value of 1.1 μm compared to SAC305 solder wire which is 2.9 μm.Thus,it is showed that solder powder improved the solder joint properties compared to conventional solder wire when exposed to laser soldering.
机译：本文介绍了纤维激光焊接不同参数对Cu Pad焊盘两种无铅焊料制造的界面反应的影响。本文的目的是研究金属间化合物厚度（IMC）形成和两种不同的润湿角当它暴露于激光功率和扫描时间的变化时焊料制造的类型。使用200W的光纤激光器继续波（CW）在该实验中使用了SAC305焊点和印刷铜板之间的连接。连续激光功率是在72W至88W之间的范围和1.5s和2.5s的扫描时间被选择用于创建加入。FLUX用于激光焊接实验中，以在整个焊料中获得均匀的热分布。通过使用光学和冶金显微镜观察机械性能。结果表明，SAC305焊料粉末表现出良好的润湿角度，最小值为18.18°，焊点最小的润湿角度为26.12°就IMC层比较而言，与SAC305焊点相比，焊料粉末具有更薄的IMC层，其值为1.1μm，与SAC305焊点为2.9μm。，它显示焊料粉末在暴露时改善了与常规焊丝相比的焊接接头性能激光焊接。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱：kefu@zhangqiaokeyan.com

京公网安备：11010802029741号 ICP备案号：京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有

  • 客服微信

  • 服务号