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Fabrication of 90° Wall of {100} Plane on (100) Si by NaOH Solution Via Design of Experiments

机译:通过实验设计通过NaOH溶液在(100)Si上的90°壁的制造

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The experimental trials were conducted by design of experiments (DOE) technique to find an anisotropic wet etching condition that achieves 90° wall angle on silicon (100) orientation wafer. Three considered factors assigned to the DOE were NaOH concentration, solution temperature, and stirring speed. The response aimed for this study was not only targeting at 90°wall but also providing highest etch rate. The experimental results showed that in order to fabricate the 90° wall angle, the best etching condition using was 30% wt NaOH concentration, 80°C solution temperature, and 300 rpm stirring speed. This condition gave an etch rate of 1245 nm/min with surface roughness (Ra) of 701.48 nm.
机译:通过设计实验(DOE)技术进行实验试验,以找到各向异性湿法蚀刻条件,该条件在硅(100)取向晶片上实现了90°壁角。分配给DOE的三个被认为是NaOH浓度,溶液温度和搅拌速度。旨在本研究的响应不仅瞄准90°壁,而且提供最高的蚀刻速率。实验结果表明,为了制造90°壁角,使用最佳蚀刻条件为30%wt NaOH浓度,80℃溶液温度和300rpm搅拌速度。该条件具有1245nm / min的蚀刻速率,表面粗糙度(Ra)为701.48nm。

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