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首页> 外文会议>ASME International Mechanical Engineering Congress and Exposition >A NOVEL PROJECTION MOIRE SYSTEM FOR MEASURING PWBA WARPAGE DURING SIMULATED OPTIMIZED CONVECTIVE REFLOW PROCESS
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A NOVEL PROJECTION MOIRE SYSTEM FOR MEASURING PWBA WARPAGE DURING SIMULATED OPTIMIZED CONVECTIVE REFLOW PROCESS

机译：一种新型投影莫尔系统，用于测量模拟优化对流回流过程中的PWBA翘曲

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摘要

The shadow moire technique is a widely used method of measuring printed wiring board (PWB) warpage. It has a high resolution, high accuracy and is suitable for use in an online environment. A shortcoming of the shadow moire technique is that it cannot be used to measure PWBs populated with chip packages. In this paper, a novel warpage measurement system based on the projection moire technique is presented. The system can be used to measure bare PWBs as well as PWBs populated with chip packages. In order to use the projection moire system to accurately determine the warpage of PWBs and chip packages separately, an automated chip package detection algorithm based on active contours is utilized. Unlike the shadow moire technique which uses a glass grating, the projection moire technique uses a virtual grating. The virtual grating sizes can be adjusted, making it versatile for measuring various PWB and chip package sizes. Without the glass grating, which is a substantial heat inertia, the PWB/PWBA/chip package sample can be heated more evenly during the thermal process. The projection moire system described in this paper can also be used to measure PWB/PWBA/chip package warpage during convective reflow processes. In this paper, the characteristics of the projection moire warpage measurement system will be described. In addition, the system will be used to measure the warpage of a PWB and plastic ball grid array (PBGA) packages during a Lee optimized convective reflow process. It is concluded that this projection moire warpage measurement system is a powerful tool to study the warpage of populated PWBs during convective reflow processes.
机译：影子莫尔技术是一种广泛使用的测量印刷线路板（PWB）翘曲的方法。它具有高分辨率，高精度，适用于在线环境中。影子莫尔技术的缺点是它不能用于测量用芯片包装填充的PWB。本文提出了一种基于投影莫尔技术的新型翘曲测量系统。该系统可用于测量裸PWB以及填充芯片封装的PWB。为了使用投影莫尔系统以单独准确地确定PWB和芯片封装的翘曲，利用基于活动轮廓的自动芯片封装检测算法。与使用玻璃光栅的影子莫尔技术不同，投影莫尔技术使用虚拟光栅。可以调整虚拟光栅尺寸，使其多功能地测量各种PWB和芯片封装尺寸。在没有玻璃光栅的情况下，该玻璃光栅是大惯性的，可以在热过程中更均匀地加热PWB / PWBA /芯片封装样品。本文描述的投影莫尔系统还可用于测量对流回流过程中的PWB / PWBA /芯片封装翘曲。本文将描述投影莫尔翘曲测量系统的特性。此外，系统将用于测量在LEE优化的对流回流过程中测量PWB和塑料球栅阵列（PBGA）包装的翘曲。结论是，该投影莫尔翘曲测量系统是在对流回流过程中研究人口稠密的PWB翘曲的强大工具。

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