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Using NH3 Plasma Treated Spin-on Low-k film as Barrier Metal-Free Dielectric to Suppress Copper Diffusion and Improve Its Ashing Resistance

机译：使用NH3等离子体处理的旋转低k薄膜作为阻挡金属电介质，以抑制铜扩散并改善其灰化抗性

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In integral circuit process,photoresist stripping(ashing)by using oxygen plasma is inevitable.Organic SOP will suffer rapid oxidation during the ashing step.Furthermore,the carbon contented in the organic SOP would be removed.

机译：在整体电路过程中，通过使用氧等离子体的光致抗蚀剂汽提（灰化）是不可避免的。有机SOP在灰化步骤期间将遭受快速氧化。加入有机SOP中含有的碳。

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《The Meeting of the Electrochemical Society》|2000年||共1页
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I-Chung Deng; Yao-Pin Tsai; Sy-Jer Yeh;
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中图分类化学工业;
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1. Suppression of Copper Diffusion Through Barrier Metal-Free Hydrogen Silsesquioxane Dielectrics By NH3, Plasma Treatment [J] . K.Chang, I.Deng Electrochemical and solid-state letters . 1999,第12期

机译：NH3抑制等离子体处理无阻挡金属氢倍半硅氧烷介电体中的铜扩散
2. Plasma Enhanced Chemical Vapor Deposition of Manganese on Low-k Dielectrics for Copper Diffusion Barrier Application [J] . Nicolas Jourdan, Yohan Barbarin, Kristof Croes ECS Solid State Letters . 2013,第3期

机译：在低k电介质上的等离子体增强化学气相沉积法在铜扩散阻挡层中的应用
3. Evaluation of New Amorphous Hydrocarbon Film for Copper Barrier Dielectric Film in Low-k Copper Metallization [J] . Hiraku Ishikawa, Toshihisa Nozawa, Takaaki Matauoka, Japanese journal of applied physics . 2008,第4issue2期

机译：低k铜金属化中用于阻挡铜介电膜的新型非晶碳膜的评价
4. Using NH3 Plasma Treated Spin-on Low-k film as Barrier Metal-Free Dielectric to Suppress Copper Diffusion and Improve Its Ashing Resistance [C] . I-Chung Deng, Yao-Pin Tsai, Sy-Jer Yeh The Meeting of the Electrochemical Society . 2000

机译：使用NH3等离子体处理的旋转低k薄膜作为阻挡金属电介质，以抑制铜扩散并改善其灰化抗性
5. Integration and compatibility studies of SiLK low-k polymer dielectrics with tantalum-based diffusion barrier/adhesion promoter films. [D] . Bian, Zailong. 2003

机译：SiLK低k聚合物电介质与钽基扩散阻挡/粘附促进剂薄膜的集成和相容性研究。
6. Spectroscopic Study of Plasma Polymerized a-C:H Films Deposited by a Dielectric Barrier Discharge [O] . Thejaswini Halethimmanahally Chandrashekaraiah, Robert Bogdanowicz, Eckart Rühl, 2016

机译：介电势垒放电沉积的等离子体聚合a-C：H薄膜的光谱研究
7. Enhancement of moisture resistance of spin-on low-k HSQ films by hot wire generated atomic hydrogen treatment [O] . KUMBHAR ALKA A, SINGH SUNIL KUMAR, DUSANE RO 2006

机译：热丝产生原子氢处理增强旋涂低k HSQ薄膜的耐湿性

Using NH3 Plasma Treated Spin-on Low-k film as Barrier Metal-Free Dielectric to Suppress Copper Diffusion and Improve Its Ashing Resistance

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