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Analysis of Pore Sealing Processes and TiN Diffusion Barrier Deposition on a Porous Ultra Low-k Dielectric by Ellipsometric Porosimetry and PALS - (PPT)

机译：通过椭圆形孔隙瘤和PALS - （PPT）多孔超低k电介质孔密封工艺及锡扩散阻挡沉积分析 - （PPT）

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Porosimetry using PALS and DBS are promising supplements to ellipsometric porosimetry for analysis of thin low-k dielectric films: - Depth depending determination of pore sizes and pore size distributions - Depth depending analysis of process effects on the chemical structure of the material. Main advantages: - Sealed layers can be analyzed, which is not possible using EP - Information on both closed and open porosity is obtained. MePS setup at HZDR allows fast spectra recording at improved conditions.

机译：使用PALS和DBS的孔隙素测量是对椭百分子测量孔隙测定法的供应，用于分析薄的低k介电膜： - 深度取决于孔径和孔径分布的测定 - 深度取决于对材料的化学结构的过程效应分析。主要优点： - 可以分析密封层，从而获得了闭合孔隙率的EP - 信息不可能。 HZDR的MEPS设置允许在改进的条件下进行快速谱记录。

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《Advanced Metallization Conference》|2013年||共10页
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N. Ahner; R. Ecke; S. E. Schulz; M. Jungmann; M. Butterling; W. Anwand; A. Wagner; A. Preusse;
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1. Structural study of nanoporous ultra low-k dielectrics using complementary techniques: Ellipsometric porosimetry, X-ray reflectivity and grazing incidence small-angle X-ray scattering [J] . V. Jousseaume, G. Rolland, D. Babonneau, Applied Surface Science . 2007,第2期

机译：使用互补技术的纳米多孔超低k电介质的结构研究：椭偏孔隙率法，X射线反射率和掠入射小角度X射线散射
2. Pore Sealing of Porous Ultralow-k Dielectrics by Self-Assembled Monolayers Combined with Atomic Layer Deposition [J] . S. Armini, J. Loyo Prado, J. Swerts ECS Solid State Letters . 2012,第2期

机译：通过自组装单层与原子层沉积相结合多孔超级-K电介质的孔密封
3. Spectroscopic ellipsometry and ellipsometric porosimetry studies of CVD low-k dielectric films [J] . P. Marsik, P. Verdonck, D. Schneider, Physica status solidi . 2008,第5期

机译：CVD低k介电膜的椭圆偏振光谱和椭圆孔隙率研究
4. Analysis of Pore Sealing Processes and TiN Diffusion Barrier Deposition on a Porous Ultra Low-k Dielectric by Ellipsometric Porosimetry and PALS - (PPT) [C] . N. Ahner, R. Ecke, S. E. Schulz, Advanced Metallization Conference . 2013

机译：通过椭圆形孔隙瘤和PALS - （PPT）多孔超低k电介质孔密封工艺及锡扩散阻挡沉积分析 - （PPT）
5. Integration and compatibility studies of SiLK low-k polymer dielectrics with tantalum-based diffusion barrier/adhesion promoter films. [D] . Bian, Zailong. 2003

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8. Pore Characterization in Low-k Dielectric Films Using X-ray Reflectivity: X-ray Porosimetry [R] . Soles, C. L., Lee, H. J., Lin, E. K., 2004

机译：使用X射线反射率的低k介电薄膜中的孔表征：X射线孔隙率测定法

Analysis of Pore Sealing Processes and TiN Diffusion Barrier Deposition on a Porous Ultra Low-k Dielectric by Ellipsometric Porosimetry and PALS - (PPT)

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