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MORPHOLOGICAL CONTROL OF TIN ELECTRODEPOSITS DURING REFLOW PROCESS OF ELECTROTINNING LINE

机译:电镀线回流过程中锡电沉积的形态控制

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The flow melting behaviour of the electrolytic tinplate during reflow treatment was investigated in terms of morphological and structural changes of coating layers which were electrodeposited with variation of electrolyte temperature. During the reflow treatment, the matte deposit transformed to the reflowed state via transition regions consisted of contraction, island formation, and wetting. The matte deposits formed at low temperature exhibited wide transition regions due to poor thermal transfer between crystals because of their porous nature. While those formed at high temperature transformed very rapidly to the reflowed state by enhanced thermal transfer between the compact crystals.
机译:在回流处理期间,在回流处理过程中的流动熔化行为在电解质温度变化的情况下电沉积的涂层的形态和结构变化。在回流处理期间,通过过渡区域转化为回流状态的哑光沉积物由收缩,岛状和润湿组成。由于其多孔性质,在低温下形成的哑光沉积沉积物由于晶体之间的热传递差而显示出宽的过渡区域。虽然通过在紧凑型晶体之间提高热传递,在高温下形成的高温变换得非常迅速地变换到回流状态。

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