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首页> 外文会议>Conference on optoelectronic interconnects, integrated circuits, and packaging >Chip-scale Integration of VCSEL, Photodetector, and Microlens Arrays
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Chip-scale Integration of VCSEL, Photodetector, and Microlens Arrays

机译：vcsel，光电探测器和微透镜阵列的芯片级集成

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摘要

New generation of network application continue to demand component solutions of higher speed (10 Gbps and beyond) with good reliability and affordability. The potential of VCSEL arrays technology in meeting those demands has long been recognized and is being actively explored by many in the field. In this paper was present a few examples of VCSEL array based technology developments including monolithic integration of VCSELs an photodetector (PD) in both 1D and 2D arrays, and their hybrid integration with micro-lens array and electronic integrated circuits for optical interconnects. As we explore to achieve more functionality through integration, we also emphasize on the merits of usability of the electrical and optical interfaces of the new components, and producibility and manufacturability aspects of the new technologies.
机译：新一代网络应用继续要求具有良好可靠性和可负担性的更高速度（10 Gbps及以后）的组件解决方案。 VCSEL阵列技术在满足这些需求时长期以来一直被认可，并且在该领域的许多人正在积极探索。本文存在基于VCSEL阵列的技术开发的一些例子，包括在1D和2D阵列中的光电探测器（PD）的单片集成，以及与微透镜阵列和用于光学互连的电子集成电路的混合集成。当我们通过集成探索实现更多功能时，我们还强调了新技术的新组件电气和光学接口的可用性的优点，以及新技术的可生产性和可制造性方面。

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