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Welding Induced Alignment Distortion in DIP LD Packages: Effect of Laser Welding Sequence

机译:DIP LD封装中的焊接诱导对准失真:激光焊接序列的影响

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In pigtailing of a single mode fiber to a semiconductor laser for optical communication applications, the tolerance for displacement of the fiber relative to the laser is extremely tight, a submicron movement can often lead to a significant misalignment and thus the reduction in the power coupled into the fiber. Among various fiber pigtailing assembly technologies, pulsed laser welding is the method with submicron accuracy and is most conductive to automation. However, the melting-solidification process during laser welding can often distort the pre-achieved fiber-optic alignment. This Welding-Induced-Alignment-Distortion (WIAD) is a serious concern and significantly affects the yield for single mode fiber pigtailing to a semiconductor laser. This work presents a method for predicting WIAD as a function of various processing, laser, tooling and materials parameters. More specifically, the degree of WIAD produced by the laser welding in a dual-in-line laser diode package is predicted for the first time. An optimal welding sequence is obtained for minimizing WIAD.
机译:在单模光纤对半导体激光器进行光学通信应用的情况下,纤维相对于激光器的位移的公差非常紧,亚微米运动通常可以导致显着的错位,从而减少电力耦合到的功率纤维。在各种纤维辫子组装技术中,脉冲激光焊接是亚微米精度的方法,是自动化最具导电的。然而,激光焊接期间的熔化凝固过程通常可以扭曲预先实现的光纤对准。这种焊接诱导的对准 - 失真(WIAD)是一个严重的问题,并且显着影响单模光纤尾纤到半导体激光器的产量。该工作提出了一种预测WIAD作为各种处理,激光,工具和材料参数的方法的方法。更具体地,通过激光焊接在双线激光二极管封装中产生的WIAD的程度首次预测。获得最佳焊接序列以使WIAD最小化。

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