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首页> 外文会议>Conference on optoelectronic interconnects, integrated circuits, and packaging >VLSI Microphotonics: Issues, Challenges, and Prospects
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VLSI Microphotonics: Issues, Challenges, and Prospects

机译：VLSI缩放：问题，挑战和前景

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This paper presents an overview of our study on the subject that we categorically termed 《VLSI(very large scale integration) microphotonics》. We examine the scientific and technological issues and challenges concerning three essential steps in this technology: miniaturization, interconnection, and integration of microphotonic devices, circuits and systems in micron or submicron scale. In miniaturization, the issues on the size effect, proximity effect, energy confinement effect, microcavitiy effect, single photon effect, optical interference effect, high field effect, nonlinear effect, noise effect, quantum optical effect, and chaotic noise effect should be addressed. In interconnection, the issues of connecting identical devices (homogeneous interconnection) or non-identical devices (heterogeneous interconnection) have to be examined. Optical alignment between micro-scale devices, minimizing interconnection losses, and maintaining optical modes between devices, are to be considered. In integration, the issues of interfacing same kind of devices, two different kinds of devices, and several or many different kinds of devices have to be addressed. Other issues include the design and packaging of the integrated devices and circuits as a system for reliable function and operation. In the course of this study, we closely follow the experiences of 《VLSI microelectronics》 so that they can provide lessons, learnings, and insights that microphotonics can benefit from. Similarities, dissimilarities, advantages, and disadvantages of the two technologies are explored in such a way that they can be more effectively utilized by mutual support and complement. Directions for future studies are also discussed.
机译：本文概述了我们对我们分类称为“VLSI（非常大规模集成）缩放器”的主题的研究。我们研究了这项技术中三个基本步骤的科技问题和挑战：微型化，互连和微粒或亚微米尺度中的微量芯片装置，电路和系统集成。在小型化中，尺寸效果的问题，邻近效果，能量限制效果，微观效应，单光子效应，光学干扰效果，高场效应，非线性效应，噪声效应，量子光学效应和混沌噪声效应应得到解决。在互连中，必须检查连接相同装置（均匀互连）或非相同装置（异构互连）的问题。要考虑微尺度装置之间的光学对准，最小化互连损耗和维持器件之间的光学模式。在集成中，相同类型的设备，两种不同类型的设备和几种或许多不同类型的设备的问题必须解决。其他问题包括集成设备和电路的设计和包装作为可靠功能和操作的系统。在这项研究过程中，我们密切关注“VLSI微电子”的经验，以便他们可以提供课程，学习和洞察力，使者可以从中受益。探索了两种技术的相似性，不同，优点和缺点，使得它们可以通过相互支持和补充更有效地利用它们。还讨论了未来研究的方向。

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