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Formation of Void-Free Mixed Matrix Membranes in Environments Free of Solvent-Evaporation-Induced Stresses Comprised of Zeolites Dispersed in Glassy Polymers

机译:在不含溶剂蒸发的诱导的应力的环境中形成无空隙混合基质膜,所述应力由分散在玻璃聚合物中的沸石组成

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While improvements in permeability and selectivity have been demonstrated with mixed matrix membranes, a major factor impeding their widespread implementation is the inability to achieve well adhered polymer- sieve interfaces in films with desirable glassy polymers. A potential cause of this behavior is debonding of the interface due to stresses induced at the interface caused by contraction of the polymer matrix due to solvent evaporation. If the nascent film is adhered to a substrate, and therefore unable to contract in the plane of the film, debonding of the interface becomes increasingly likely as the Tg of the nascent film increases, in order to relieve this stress. Clearly, the Tg of the nascent film will be greater for higher Tg polymer matrices, so debonding is more likely for higher Tg matrices. Thus, preventing this stress from occurring should allow the preparation of void-free mixed matrix membranes with glassy polymer matrices. Void-free mixed matrix membranes with glassy matrices have already been prepared by casting at elevated temperatures near the Tg of the matrix or by using a plasticizer to reduce the Tg of the matrix. This minimizes stress at the interface. Another successful method has been to remove films from the substrate before they have vitrified but after they have formed a film and then allowing the remaining solvent to evaporate from an unconstrained film. Void-free films have also been prepared by melt processing the films so that there is no solvent to cause solvent induced stresses. Here, we summarize these methods and report on additional potential methods to circumvent these solvent induced stresses to prepare void-free mixed matrix membranes. A promising approach is to cast on a surface which can contract freely with the film. Several avenues to achieve this are underway and will be discussed.
机译:虽然用混合基质膜证明了渗透性和选择性的改善,但是阻碍了其广泛实施的主要因素是无法在具有所需玻璃聚合物中达到薄膜中的粘附聚合物筛选的主要因素。这种行为的潜在原因是由于在溶剂蒸发引起的聚合物基质收缩引起的界面引起的界面引起的界面的剥离。如果将新膜粘附到基板上,因此不能在薄膜的平面中收缩,则界面的剥离变得越来越多的可能随着新生膜的Tg增加,以便缓解这种应力。显然,对于更高的Tg聚合物矩阵,新增膜的Tg将更大,因此借助于更高的Tg矩阵更可能。因此,防止这种应力应允许使用玻璃聚合物基质制备无空隙的混合基质膜。通过在基质Tg附近的升高的温度下或通过使用增塑剂来减少基质的Tg,已经通过浇铸的无空隙混合基质膜。这最大限度地减少了界面处的应力。另一种成功的方法是在玻璃化之前从基板中除去薄膜,但在它们形成膜之后,然后允许剩余的溶剂从未受到约束膜蒸发。也通过熔融加工薄膜制备无空隙膜,使得没有溶剂引起溶剂诱导的应力。在这里,我们总结了这些方法和报告关于额外的潜在方法来规避这些溶剂诱导的应力以制备无空隙混合基质膜。有希望的方法是施放在可以与薄膜自由收缩的表面上。若干途径正在进行一下,并将讨论。

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