Due to upcoming new technologies and a rise in complexity of electronic devices electronic scrap recycling is challenged by an increasing complex source material. Besides the classic components as plastics, copper, iron, aluminum, gold, silver, palladium and minor amounts of zinc, tin and lead more and more elements are introduced to ensure the functionality of electronic products. As a lot of these new elements are only applied in very small quantities and in most cases widely dissipated, new approaches must be developed to enable a feasible recovery of these materials. For most of these substances like indium, gallium, germanium or tantalum, the current end of life recycling rate is below one percent [1], though electronic devices represent a major application of these critical elements.
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