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首页> 外文会议>Meeting,Division of Polymeric Material: Science and Engineering American Chemical Society >Novel Method for the Fabrication of 3D Wiring within a Nanoporous Membrane for High-density Package Substrates
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Novel Method for the Fabrication of 3D Wiring within a Nanoporous Membrane for High-density Package Substrates

机译：用于高密度封装基板的纳米多孔膜内在纳米多孔膜内制造三维布线的新方法

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摘要

In recent years, the integration and miniaturization of various electric and electronic devices has progressed remarkably. Highdensity multi-layer wiring is essential to integrate and interconnect micro devices. In general, multi-layer wiring are manufactured by laminating two dimensional wiring layers. And adjacent wiring layers are connected to each other by conductive columns called vias. The density of multi-layer wiring is dependent on both wiring pitch and via diameter. Downsizing wiring pitch is relatively easy. However, it is difficult to make fine vias at low cost. In the conventional method, a via is formed by stuffing a metal into a drilled via hole. Drilling a fine via hole is difficult but miniaturization of via holes is essential to make fine multi-layer wiring.
机译：近年来，各种电气和电子设备的整合和小型化取得了显着的进展。高密度多层布线对于集成和互连微器件至关重要。通常，通过层叠二维布线层制造多层布线。相邻的布线层通过称为通孔的导电列彼此连接。多层布线密度取决于布线间距和通过直径。缩小布线间距相对容易。但是，难以以低成本制造精细的通孔。在传统方法中，通过将金属填充到钻孔的通孔中形成通孔。钻孔孔孔难以但通孔的小型化对于制造精细的多层布线是必不可少的。

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