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Gas Evacuation Technique: From Lab to Reality

机译：天然气疏散技术：从实验室到现实

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The recent addition of glass reinforced polyester thermoset (GRPT) to the list of gas assist injection molded-able (GAIM) materials has been met with enthusiasm from molders and original equipment manufacturers alike. Bulk Molding Compound (a GRPT) demonstrates molding properties that provide the foundation for a simple, yet effective method of coring thick cross-sectioned/ channel-type designs. The combination of this processing advancement with the inherent properties associated with Bulk Molding Compound (BMC) has opened new markets through a patent increase in part value. Gas Evacuation Technique (GET) has moved from a laboratory concept to an OEM specified feature in a less than two years. Developed as a response to pressure being applied by engineering thermoplastics (ETP) and formed metals (FM), GET has facilitated a restoration and marked expansion of BMC use potentials. Many applications historically dominated by ETP and/or FM now represent opportunities for BMC as well. Adjunct to the net savings GAIM provides via the reduction of material consumption and production cycle, BMC represents a low cost alternative to popular ETPs and FMs when compared on a volumetric scale (statement based on OEM/molder interviews and the Plastics News resin report, January 12, 2004). Through ongoing research and development conducted by Bulk Molding Compounds, Incorporated (West Chicago, Illinois) comparative property studies have been carried out utilizing samples that were both solid and cored to various wall thicknesses employing GET. The results of this testing have shown key physical properties associated with BMC are affected by the evacuation and reclamation of the internal channel material. The net benefit of this research (described in detail below) is a value based connection between material savings, cycle time and molded part properties. A greater understanding of the dynamics of this relationship will ensure the most effective, and appropriate use of this molding technology.
机译：最近加入了玻璃增强涤纶热固性（GLD）的气体辅助注塑（GAIM）材料列表，从模板和原始设备制造商的热情中得到了热情。散装成型化合物（GPT）证明了模塑性能，为芯片厚横截面/通道型设计的简单但有效方法提供了基础。这种加工进步与与散装成型化合物（BMC）相关的固有性质的组合通过部分值的专利升高打开了新的市场。天然气疏散技术（GET）已从实验室概念移动到不到两年的OEM指定功能。由于工程热塑性塑料（ETP）和形成的金属（FM）而施加对压力的反应，促进了BMC使用潜力的恢复和显着的扩展。许多历史上由ETP和/或/或FM主导的应用程序现在也代表了BMC的机会。净储蓄Gaim的辅助通过减少材料消费和生产周期，BMC在比较的体积规模（基于OEM / DEMER访谈和塑料新闻树脂报告和1月份的塑料新闻树脂报告）时，BMC代表了流行的ETPS和FMS的低成本替代品12,2004）。通过散装成型化合物进行的正在进行的研发，掺入（西芝，伊利诺伊州）的比较性质研究已经利用固体和芯片的样品来进行使用的各种壁厚。该测试的结果显示了与BMC相关的关键物理性质受到内部通道材料的疏散和填充的影响。本研究的净利润（下面详细描述）是材料节省，循环时间和模压部件性能之间基于价值的连接。对这种关系动态的更大了解将确保这种模制技术的最有效和适当使用。

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