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Analysis of AXI Test on Fine Pitch Components between Lead Free and Tin/Lead Assembly

机译：铅和锡/铅组件铅和锡/铅组件之间的细间距组件的AXI试验分析

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By now, most people in the industry understand how complex it is to convert a factory from using a Tin-Lead (Eutectic) Solder process to a Lead Free process. The implementation of this change requires more than just developing a new process to replace the current one that companies have spent years optimizing. The Lead Free implementation also brings up a new challenge in calibrating and adjusting the equipment on the production lines to optimize their performance with the Lead Free process1. For several years now, Flextronics has been using Automated X-ray Inspection (AXI) as effective test equipment for the inspection of PCBA solder quality, as well as a process improvement tool. By analyzing the variable measurements provided by AXI, Flextronics has been able to improve the SMT process. Recently, Flextronics wanted to determine if there was any difference in the AXI measurements of Lead Free and Tin-Lead solder joints. In order to do so, a Flextronics team used AXI to measure two types of solder or "Test Vehicles:" a Test Vehicle that consisted strictly of Lead Free solder joints/processes and a Test Vehicle that consisted strictly of Tin/lead solder joints/processes. Testing was conducted under two different "Test Conditions." This phrase refers to the manner in which the equipment was calibrated. Under Test Condition #1, the AXI machine was calibrated with a Lead Free Calibration and Adjustment (C&A) panel. Under Test Condition #2, the AXI machine was calibrated with a Tin/Lead C&A panel. The objective of this study was to: (1) Assess the current AXI Gage Repeatability & Reproducibility for Lead Free Test Vehicle with Lead Free Test Condition. (2) Compare and correlate several measurements, including BGA Ball diameter, BGA Ball Thickness, Fine Pitch Gullwing Heel Thickness, Center Thickness, and Fillet Length, and Resistor 0402 Pad Thickness, for the two types of Test Vehicles (Lead Free and Tin/Lead) under both the Lead Free and Tin/Lead C&A Calibration Test Conditions. The Test Vehicle boards contained 12 BGAs and two FPGullwing devices with a pitch size of 16 mils. More than 240,000 data points were collected for the study. We analyzed the data collected for BGA diameter, BGA Thickness, Fine Pitch Gullwing Heel thickness, Center thickness, and Fillet Length, and Resistor 0402 pad thickness using the SPC tool MINITAB and its Mood's Median Test tool. The results showed a statistical difference for most of the measurements under both test conditions, Lead Free and Tin/Lead C&A. The majority of the differences for the measurements averaged in the range of 5% to 10% for the same type of Test Vehicle boards under the different Test Conditions. The AXI test results not only report attribute data; it also provides variable data (the actual numerical measurements). With the variable data obtained from this automatic test method, the AXI can be used as a good SMT process improvement tool, as well as a tool for process defect detection. The variable data has been used to help Flextronics effectively control its SMT processes. Based on our studies, we found that it is better to test Lead Free or Tin/Lead product boards with corresponding test condition. For example, the FPGullwing average open signal of a Lead Free board using Test Condition #2 should be 16.5% higher than when using Test Condition #1. The FPGullwing average open signal of the Tin/Lead board using Test Condition #1 should be 15.5% lower than when using Test Condition #2.
机译：到目前为止，行业中的大多数人都知道将工厂转换为使用锡铅（共晶）焊料过程到无铅过程中的复杂程度。这种变化的实施需要的不仅仅是制定一个新的过程，以取代公司已经过度优化的目前的进程。无铅实施也在校准和调整生产线上的设备来提出新的挑战，以优化它们的性能与无铅工艺1。持续了几年，Flextronics一直在使用自动X射线检测（AXI）作为检查PCBA焊料质量的有效测试设备，以及工艺改进工具。通过分析AXI提供的变量测量，Flextronics已经能够改善SMT过程。最近，Flextronics希望确定无铅和锡引线焊点的AXI测量值是否有任何差异。为了这样做，Flextronics团队使用AXI来测量两种类型的焊料或“测试车辆：”测试车辆，该测试车辆严格由无铅焊点/工艺和测试车辆组成，该试验载体是严格的锡/铅焊点/流程。测试是在两个不同的“测试条件”下进行的。这句话是指设备被校准的方式。在测试条件下＃1，AXI机器用无铅校准和调节（C＆A）面板进行校准。在测试条件下＃2，AXI机器用锡/铅C＆A面板进行校准。本研究的目的是：（1）评估当前的AXI Gage重复性和具有无铅试验条件的无铅试验载体的再现性。 （2）比较和关联多次测量，包括BGA球直径，BGA球厚度，精细间距鸥翼根部厚度，中心厚度和圆角长度和电阻器0402垫厚度，对于两种类型的测试车辆（无铅和锡/铅在无铅和锡/铅C和校准测试条件下。测试车板包含12个BGA和两个FPGULLWING器件，间距为16密耳。该研究收集了超过240,000个数据点。我们分析了BGA直径，BGA厚度，精细间距沟槽鞋跟厚度，中心厚度和圆角长度的数据，以及使用SPC工具Minitab及其情绪中值测试工具的电阻0402垫厚度。结果表明，在试验条件下，无铅和锡/铅C＆A下的大部分测量结果表现出统计学差异。在不同的试验条件下，相同类型的试验载体板的测量范围的大部分差异在5％至10％的范围内。 AXI测试结果不仅报告属性数据;它还提供可变数据（实际数值测量）。利用从该自动测试方法获得的可变数据，AXI可用作良好的SMT工艺改进工具，以及用于工艺缺陷检测的工具。可变数据已被用于帮助Flextronics有效地控制其SMT过程。根据我们的研究，我们发现，使用相应的测试条件测试无铅或锡/铅产品板更好。例如，使用测试条件＃2的无铅板的FPGullWing平均打开信号应比使用测试条件＃1的16.5％高。使用测试条件＃1的锡/铅板的FPGullWing平均打开信号应低于使用测试条件＃2时的15.5％。

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