SiC DIE-ATTACH ON DBA SUBSTRATE WITH CERAMIC NANO-PARTICLES ADDED HYBRID Ag PARTICLE PASTE

机译：用陶瓷纳米颗粒添加杂交Ag颗粒浆料的DBA衬底上的SiC模芯

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Lead-free die-attach materials for SiC power semiconductor devices are urgently needed because of the rapid development of renewable energy technologies. Hybrid Ag pastes consist of micron-sized Ag flakes hybridized with submicron-sized Ag particles are considered as a potential candidate.In our study, we added three types of SiC particles into the hybrid Ag paste in order to improve its performance. Uniform distribution of both Ag fillers and SiC particles had been observed by a modified mixing method. The shear strength and electrical resistivity of SiC-added hybrid Ag paste was illustrated. A preliminary study of the actual applicability of SiC-added hybrid Ag paste was tested by SiC-DBA bonding structure.

机译：由于可再生能源技术的快速发展，因此迫切需要无铅模具安装材料。杂交AG浆料由微米尺寸的AG薄片组成，与亚微米尺寸的AG颗粒杂交被认为是潜在的候选者。我们的研究中，我们将三种类型的SiC粒子添加到混合AG浆料中，以提高其性能。通过改性混合方法观察到Ag填充物和SiC颗粒的均匀分布。示出了SiC添加的杂交效应浆料的剪切强度和电阻率。通过SiC-DBA键合结构测试了对SiC - 添加的杂交效应浆料的实际适用性的初步研究。

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《Materials Science Technology Conference and Exhibition》|2014年||共8页
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作者
Hao ZHANG; Shijo NAGAO; Katsuaki SUGANUMA;
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原文格式 PDF
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中图分类 TG14-532;
关键词
SiC die-attachment; Ag sintering paste; SiC particles; DBA;

机译：的SiC 模具附件;银烧结膏;碳化硅颗粒;DBA;

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1. Addition of SiC Particles to Ag Die-Attach Paste to Improve High-Temperature Stability; Grain Growth Kinetics of Sintered Porous Ag [J] . Zhang Hao, Nagao Shijo, Suganuma Katsuaki Journal of Electronic Materials . 2015,第10期

机译：在Ag压铸胶中添加SiC颗粒以提高高温稳定性;烧结多孔Ag的晶粒长大动力学
2. Thermal shock reliability of a GaN die-attach module on DBA substrate with Ti/Ag metallization by using micron/submicron Ag sinter paste [J] . Kim Dongjin, Chen Chuantong, Pei Chun, Japanese journal of applied physics . 2019,第SB期

机译：使用微米/亚微米Ag烧结糊剂在具有Ti / Ag金属化的DBA衬底上的GaN晶粒连接模块的热冲击可靠性
3. Interface reaction and evolution of micron-sized Ag particles paste joining on electroless Ni-/Pd-/Au-finished DBA and DBC substrates during extreme thermal shock test [J] . Chen Chuantong, Zhang Zheng, Kim Dongjin, Journal of Alloys and Compounds: An Interdisciplinary Journal of Materials Science and Solid-state Chemistry and Physics . 2021,第1期

机译：界面反应和微米尺寸Ag颗粒浆料在极端热冲击试验期间接合电镀Ni-/ Pd- / Au-in in Endent DBA和DBC基材的粘贴
4. SiC DIE-ATTACH ON DBA SUBSTRATE WITH CERAMIC NANO-PARTICLES ADDED HYBRID Ag PARTICLE PASTE [C] . Hao ZHANG, Shijo NAGAO, Katsuaki SUGANUMA Materials Science Technology Conference and Exhibition . 2014

机译：用陶瓷纳米颗粒添加杂交Ag颗粒浆料的DBA衬底上的SiC模芯
5. Fabrication of mullite-bonded porous SiC ceramics from multilayer-coated SiC particles through sol-gel and in-situ polymerization techniques. [D] . Ebrahimpour, Omid. 2014

机译：通过溶胶-凝胶和原位聚合技术从多层涂覆的SiC颗粒制备莫来石键合多孔SiC陶瓷。
6. Correction: The Fabrication of Nano-Particles in aqueous solution from Oxyfluoride Glass Ceramics by Thermal Induction and Corrosion Treatment [O] . Hua Yu, Nan Hu, Ya-Nan Wang, 2011

机译：校正：通过热感应和腐蚀处理从氟氧化物玻璃陶瓷水溶液中制备纳米颗粒
7. Evaluation of high temperature reliability of SiC die attached structure with sinter micron-size Ag particles paste on Ni-P/Pd/Au plated substrates [O] . Chuantong Chen, Zheng Zhang, Katsuaki Suganuma 2020

机译：Ni-P / Pd / Au电镀基板上烧结微粒尺寸Ag颗粒粘贴高温可靠性的评价

SiC DIE-ATTACH ON DBA SUBSTRATE WITH CERAMIC NANO-PARTICLES ADDED HYBRID Ag PARTICLE PASTE

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