Leveraging Solderless Press-Fit Technology In Automotive Micro Electronics Power Modules, Applications to Improve Assembly Efficiency and Design Flexibility - (PPT)

机译：在汽车微电子电源模块中利用无焊接压配技术，应用提高装配效率和设计灵活性 - （PPT）

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Press Fit technology has advanced to a state that: Not all press-fits are alike, but more importantly, not all press-fit technology is proven and tested. Trust the data!; Press-fit is not a commodity product. Pick a qualified proven design and an application knowledgeable supplier; Design and performance controls have matured that adaptability of press-fit technology to Automotive Applications is not only reliable but preferred; Advanced alloys for press-fit technology and packaging designs allows for press-fit to be used for higher current interconnects; Use of press-fit technology for termination between power electronic subassemblies can eliminate very complex soldering processes and provide protection against assembly CTE mismatches.

机译：按FET技术已经前进到了一个状态：并非所有按压符合都是相似的，但更重要的是，并非所有按压拟合技术都被证明并测试。相信数据！压配不是商品产品。选择合格的经过合格的设计和申请知识渊博的供应商;设计和性能控制已经成熟，压力拟合技术对汽车应用的适应性不仅可靠但优选;用于压紧技术和包装设计的先进合金允许压配合用于更高电流互连;用于电力电子子组件之间终止的压配技术可以消除非常复杂的焊接工艺，并提供针对组装CTE不匹配的保护。

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《IMAPS Advanced Technology Workshop on Automotive Microelectronics and Packaging》|2012年||共26页
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Joseph Lynch; Jeff Parrish;
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机译：压装技术，一种用于安装功率模块的无焊方法
2. Power module electronics in HEV/EV applications: New trends in wide-bandgap semiconductor technologies and design aspects [J] . Matallana A., Ibarra E., Lopez I., Renewable & Sustainable Energy Reviews . 2019,第Octa期

机译：HEV / EV应用中的功率模块电子产品：宽带隙半导体技术和设计方面的新趋势
3. Power module electronics in HEV/EV applications: New trends in wide-bandgap semiconductor technologies and design aspects [J] . Matallana A., Ibarra E., Lopez I., Renewable & Sustainable Energy Reviews . 2019,第OCTa期

机译：HEV / EV应用中的功率模块电子产品：宽带隙半导体技术和设计方面的新趋势
4. Leveraging Solderless Press-Fit Technology In Automotive Micro Electronics Power Modules, Applications to Improve Assembly Efficiency and Design Flexibility - (PPT) [C] . Joseph Lynch, Jeff Parrish IMAPS Advanced Technology Workshop on Automotive Microelectronics and Packaging . 2012

机译：在汽车微电子电源模块中利用无焊接压配技术，应用提高装配效率和设计灵活性 - （PPT）
5. Application of total quality methods to improve efficiency and increase flexibility in automotive technology. [D] . Tiranasar, Nut. 2007

机译：运用全面质量方法提高效率并提高汽车技术的灵活性。
6. Power Electronic Semiconductor Materials for Automotive and Energy Saving Applications – SiC GaN Ga2O3 and Diamond [O] . Peter J. Wellmann, * -1

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Leveraging Solderless Press-Fit Technology In Automotive Micro Electronics Power Modules, Applications to Improve Assembly Efficiency and Design Flexibility - (PPT)

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