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COPPER RECOVERY FROM PRINTED CIRCUIT BOARD OF E-WASTE

机译：电子废物印刷电路板铜回收

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In an attempt to raise the copper grade of Printed Circuit board (PCB) by removing other components, carbonization treatment was investigated. The crushed PCB without surface-mounted parts was carbonized under nitrogen atmosphere. After screening, the char was classified by size into oversized pieces, undersized pieces and powder. The copper foil and glass fiber pieces were liberated and collected in undersized fraction. The liberation of copper foil from the oversized pieces was also investigated. The copper foil was liberated easily from glass fiber by stamping treatment. Liberation rate of copper foil was high at high carbonized temperature. The experimental results indicated that 90% of oversized char was liberated and the copper foil recovery from PCB carbonized at 1073K was 110kg/t. The copper recovery from char powder by flotation was also investigated. 15% of the copper grade and 80 % of the copper recovery were obtained, whereas the removal rate of silicon was 55%.
机译：通过除去其他组分来试图提高印刷电路板（PCB）的铜等级，研究了碳化处理。没有表面安装部件的碎PCB在氮气氛下碳化。在筛选后，将焦炭尺寸分为超大件，尺寸的碎片和粉末。将铜箔和玻璃纤维片释放并收集以口无缺的级分。还研究了超大型碎片的铜箔的解放。通过冲压处理将铜箔容易从玻璃纤维释放。铜箔的解放速率高碳化温度高。实验结果表明，90％的超大性焦炭被释放，从1073K碳化的PCB铜箔回收率为110kg / t。还研究了通过浮选从炭粉的铜回收。得到15％的铜级和80％的铜回收率，而硅的去除率为55％。

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