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COPPER RECOVERY FROM PRINTED CIRCUIT BOARD OF E-WASTE

机译：从电子垃圾印刷电路板回收铜

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摘要

In an attempt to raise the copper grade of Printed Circuit board (PCB) by removing other components, carbonization treatment was investigated. The crushed PCB without surface-mounted parts was carbonized under nitrogen atmosphere. After screening, the char was classified by size into oversized pieces, undersized pieces and powder. The copper foil and glass fiber pieces were liberated and collected in undersized fraction. The liberation of copper foil from the oversized pieces was also investigated. The copper foil was liberated easily from glass fiber by stamping treatment. Liberation rate of copper foil was high at high carbonized temperature. The experimental results indicated that 90% of oversized char was liberated and the copper foil recovery from PCB carbonized at 1073K was ll0kg/t. The copper recovery from char powder by flotation was also investigated. 15% of the copper grade and 80 % of the copper recovery were obtained, whereas the removal rate of silicon was 55%.
机译：为了通过去除其他成分来提高印刷电路板（PCB）的铜等级，对碳化处理进行了研究。在氮气氛围下，将没有表面安装部件的压碎PCB碳化。筛选后，炭按大小分为大块，小块和粉末。释放出铜箔和玻璃纤维碎片，并以较小的比例收集。还研究了铜箔从超大型工件中的释放。通过冲压处理，铜箔容易从玻璃纤维中释放出来。高温下铜箔的析出率高。实验结果表明，释放了90％的超大炭，在1073K碳化的PCB中回收的铜箔为110kg / t。还研究了通过浮选从焦粉中回收铜。获得了15％的铜品位和80％的铜回收率，而硅的去除率为55％。

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  • 来源
    《Recycling of electronic waste II》|2011年|p.33-38|共6页
  • 会议地点 San Diego CA(US);San Diego CA(US)
  • 作者

    Toyohisa Fujita; Hiroyuki Ono; Gjergj Dodbiba; Seiji Matsuo; Katsunori Okaya;

  • 作者单位

    Department of Systems Innovation, School of Engineering, The University of Tokyo 7-3-1 Hongo, Bunkyo-ku, Tokyo 113-8656, Japan;

    Department of Systems Innovation, School of Engineering, The University of Tokyo 7-3-1 Hongo, Bunkyo-ku, Tokyo 113-8656, Japan;

    Department of Systems Innovation, School of Engineering, The University of Tokyo 7-3-1 Hongo, Bunkyo-ku, Tokyo 113-8656, Japan;

    Department of Systems Innovation, School of Engineering, The University of Tokyo 7-3-1 Hongo, Bunkyo-ku, Tokyo 113-8656, Japan;

    Department of Systems Innovation, School of Engineering, The University of Tokyo 7-3-1 Hongo, Bunkyo-ku, Tokyo 113-8656, Japan;

  • 会议组织
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 废物处理与综合利用;
  • 关键词

    carbonization; printed circuit board; recycling;

    机译：碳化印刷电路板;回收利用;

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